| Customization: | Available |
|---|---|
| Type: | Fiber Transceiver |
| Wiring Devices: | ODF |
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| Comparative dimension | Advantages of FINISAR module | Typical characteristics of other modules | Comparative analysis |
| Core performance | -Support 25Gbps high-speed transmission, and the bandwidth utilization rate is increased by 150% compared with the traditional 10G module. |
-The upper speed limit of ordinary 1×9 module is 2.5Gbps (such as low-speed control in industrial scene) | It is suitable for high-bandwidth scenarios such as data center /5G base station, and significantly improves the network throughput. |
| Design structure | -It adopts SFP+ package, integrates metal shielding layer and precision VCSEL laser, and improves the anti-electromagnetic interference ability by 30%. |
-Silicon optical module relies on CMOS process to integrate optoelectronic devices, which is compact in structure but depends on advanced process. |
Give consideration to reliability and flexibility, and adapt to the upgrade requirements of traditional switches; Silicon optical module is suitable for ultra-large-scale optoelectronic integration, but its cost is high. |
| acclimatization | -wide temperature design (-40ºC~85ºC), industrial-grade seismic performance (axial tension > 50N) | -ordinary SFP module only supports 0ºC~70ºC, and its anti-vibration ability is weak. | Outstanding stability in extreme environments such as rail transit and power system. |
| compatibility | -conform to SFP+ MSA protocol, and be compatible with switches of major brands. | -Some low-priced module protocols have poor adaptability (for example, private protocols lead to signal intercommunication) | Reduce the risk of equipment replacement and ensure plug and play. |
| Power consumption and energy efficiency | -Typical power consumption is 1.2W~1.5W(25Gbps scenario), and it supports wide voltage input of 3.15V~3.46V | The power consumption of silicon optical module is as low as 0.8W~1.0W (depending on photoelectric co-packaging technology). | Suitable for the traditional power supply environment, the silicon optical module is better in energy efficiency, but the supporting infrastructure needs to be upgraded. |
| Maintenance and expansibility | -Hot plug design, supporting online replacement and intelligent diagnosis (DDM real-time monitoring optical power/temperature) | -The 1×9 module needs to be welded and installed without power supply, and the maintenance cost is high. | Significantly reduce the complexity of operation and maintenance and adapt to the rapid deployment of high-density data centers. |
| Authentication and reliability | -Through RoHS and CE certification, MTBF (mean time between failures) is more than 100,000 hours. | -Some non-brand modules lack strict certification, and the failure rate is high (such as optical power attenuation caused by chip renovation). |
Ensure long-term stable operation and reduce the risk of network interruption caused by hardware failure. |
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